NBS's Smart Solutions provide the complete range of products for the Smart Card manufacturing industry needs. NBS Smart Solutions provides a well known range of equipment for:
We are the first in this industry to provide competitive equipment that performs the milling process, whereby a cavity is created prior to the chip embedding. We now have a strong reputation in the industry and are committed to continued R&D.
This is linked to the hot Melt process, using a heat activated adhesive tape to embed the chip. We can perform this lamination process off line as a separate machine or in line.
The most valuable and difficult part of the manufacturing process, we offer a complete range of embedding equipment combined with milling (combi) with throughput up to 4,000 cards per hour.
Before the final personalization in any Smart Card application, a chip pre-personalization is done to load the operating system. Production batches are large whereby the the speed of the machine is a key.
We are leading the way with technology for the Contactless industry. We can supply solutions to manufacture and personalize contactless Smart Cards:
- Assembly of the inlets
- Detection of the antennas at the milling station for the Combi cards (contactless and contact cards)
- Embedding of the chip with antenna connections
- Personalization of the contactless chip
- Printing of a contactless card
- Telecommunication
- Financial
- ID/Government
- Transport
- Pay TV
- Health care
- Loyalty
- Contactless
- and other markets too
- From milling to pre-personalization on the same hardware platform
- Same conveying system
- Same spare parts
- Easy training session
- Very easy R&D capacity
- All our machines can run as stand alone up to 4000 cards per hour
- A combination of Milling, Embedding and pre-personalization is also possible and is unique on the market: MBM Advance
- Testing/pre-personalization solutions for the micromodule directly on film. Available for all market requirements.
- Quality control by industrial vision system as an option on all our equipment. Custom system built to meet customer requirements.
- High speed and quality smart card couplers for the personalization industry.
- A complete range of specific tooling for the punch of all the micromodule existing in the market.
- Equipment to perform the SIM punching for the Telecommunication market.
- An SDK and/or our Software platform to manage the per-personalization prior to the finale personalization.
- Equipment for the microelectronic industry (Wafer handling and testing, wafer die picking, chip encapsulation and component testing).
- Laboratory/testing tools
Milling (GRX 4000 and GRX Advance) - On a stand alone mode or combined to the embedding, our milling solutions provide accuracy and speed as a major quality for the industry. Our pricing is also an asset on our competition.
Embedding (EHM 4000, LIL and MBM Advance) - We have been the very first to provide a combined machine to the Smart card industry. Our best advantage with this equipment is the modularity and the personalization and contactless capabilities, unique in the market.
Contactless (ATI 2000 and MBM Advance) Our knowledge of the contactless technology allow us to have a considerable time advantage on the competition. Either pure contactless or Combi card can be produce on our equipment.
Pre-perso (HPX series) - Up to 6000 cards per hour (depending on the personalization time). Various laser or ink Jet models can be installed as standard features
Testing (HMX and MTH series) As a strong partner of key players in the semiconductor industry, we have a complete range of micromodule testing equipment.
Smart Objects: With the growing demand on different form factors with an embedded chip, we are designing equipment to handle multiple smart objects for manufacturing as well as for personalization. Since no normalization on such objects has been issued, any projects is custom. Our R&D team can help!
 Product catalogue
LIL - Hot Melt lamination machine
MBM ADVANCE - Milling and chip embedding machine
HPX - Smart card personalization system
Persoft - Smart card & micromodule personalization software
BTM - Micromodule tension & compression test bench
FCM TCM - Bending & Torsion test machines
GRX 4000 - High speed smart card milling machine
EHM - High speed embedding machine
MTH - Micromodule Test Handler
WPC 200 Advance - Collective 200 mm wafer packing equipment
WPC 300 - Collective 300 mm wafer packing equipment
WBI 200 - Wafer back side visual inspection
PTX 10000 - Micromodule encapsulation machine
ATI - Assembly and test of inlets for contactless cards
Aptitude Tester - Parametric tester for RF
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